Ferrimagnetic vias within multi-layer 3-dimensional structures/s

Details Ferrimagnetic vias within multi-layer 3-dimensional structures/s Ferrimagnetic vias within multi-layer 3-dimensional structures/s

1993-10-19

1995-08-01

Tolin, Gerald P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174 35R, 174262, 361792, 361816, H05K 100

Patent

active

054381673

ABSTRACT:
Ferrimagnetic structures formed of ferrimagnetic vias in a unitized multilayer microcircuit structure that is formed of a plurality of co-fired insulating layers.

REFERENCES:
patent: 3638147 (1972-01-01), Denes
patent: 4647878 (1987-03-01), Landis et al.
patent: 4894114 (1990-01-01), Nathanson et al.
patent: 5312674 (1994-05-01), Haertling et al.

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