Feedthrough type three-terminal electronic component

Details Feedthrough type three-terminal electronic component Feedthrough type three-terminal electronic component

2002-06-21

2003-05-13

Dinkins, Anthony (Department: 2831)

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

C361S306300, C361S321200, C361S306100

Reexamination Certificate

active

06563689

ABSTRACT:

BACKGROUND OF THE INVENTION
1. Field of the invention
The present invention relates to a feedthrough type three-terminal electronic component having a monolithic structure formed by stacking one or more pairs of an internal signal electrode and an internal ground electrode so as to face one another across a dielectric layer, a pair of external signal electrodes which are connected to extension portions of the internal signal electrodes, and an external ground electrode connected to internal ground electrodes.
2. Description of the Related Art
FIGS. 6A and 6B
,
7
A and
7
B, and
8
illustrate a feedthrough type three-terminal electronic component (feedthrough type three-terminal capacitor) which is a type of a monolithic electronic component.
Here,
FIG. 6A
is a front cross-sectional view of a conventional feedthrough type three-terminal electronic component,
FIG. 6B
is a side cross-sectional view thereof,
FIG. 7A
is a plan view illustrating the form of an internal signal electrode, which is an element of a conventional feedthrough type three-terminal electronic component,
FIG. 7B
is a plan view illustrating the form of an internal ground electrode, and
FIG. 8
is a perspective view illustrating the external configuration of a conventional feedthrough type three-terminal electronic component.
The feedthrough type three-terminal electronic component has a structure wherein, a monolithic structure
54
(
FIG. 8
) is formed by stacking an internal signal electrode
52
(see
FIG. 7A
) and an internal ground electrode
53
(see
FIG. 7B
) so that the principal portions thereof face one another across a dielectric layer
51
as shown in
FIGS. 6A and 6B
. In addition, as shown in
FIG. 8
, a pair of external signal electrodes
55
a
and
55
b
(
FIG. 6A
) to which the extension portions
52
a
and
52
b
of internal signal electrodes
52
are connected is disposed on both end surfaces of the monolithic structure
54
, and an external ground electrode
56
(
FIG. 6B
) to which the extension portions
53
a
and
53
b
of internal ground electrodes
53
are connected is disposed on both side surfaces of the monolithic structure
54
.
Now, with a feedthrough type three-terminal electronic component (feedthrough type three-terminal capacitor) having such a structure, normally, the electronic component includes a predetermined number of ceramic green sheets
57
upon which is disposed an internal signal electrode (pattern)
52
as shown in FIG.
7
A and ceramic green sheets
58
upon which is disposed an internal ground electrode (pattern)
53
as shown in
FIG. 7B
being alternately layered, and further, outer layer ceramic green sheets (not shown) with no internal electrodes disposed thereon being layered on both the top and bottom and surfaces, and subjected to the processes of compression and baking, so that, as shown in
FIGS. 6A and 6B
, internal electrodes (the internal signal electrodes
52
and internal ground electrodes
53
) are layered with high concentration at the region X (electrode layering region) wherein the internal signal electrodes
52
and internal ground electrodes
53
are layered, but at the regions Y (extension portion layering region for signals) wherein the extension portions
52
a
and
52
b
of the internal signal electrodes
52
are disposed, and at the regions Z (extension portion layering region for grounding) wherein the extension portions
53
a
and
53
b
of the internal ground electrodes
53
are disposed, the internal electrodes (extension portions
52
a
and
52
b
and extension portions
53
a
and
53
b
) are disposed at every other layer (sparsely), meaning that there are irregularities in the layering concentration (distribution concentration) of the internal electrodes.
Consequently, at the time of baking the monolithic structure, scattering at the internal electrodes partially and selectively increases, so the sintering state of the internal electrodes becomes non-uniform, resulting in a problem wherein there are irregularities in the resistance of the internal electrodes.
Particularly, the sintering tends to be insufficient in the signal extension portion layering regions Y and the grounding extension portion layering regions Z, and connection with the external signal electrodes
55
a
and
55
b
and the external ground electrode
56
becomes poor, so there has been a problem in that the DC resistance tends to fluctuate.
Also, the resistance of the internal signal electrodes and the internal ground electrodes normally tends to become high in the event that sintering is insufficient, but these characteristics also become high in the event that sintering is excessive, and the irregularities in concentration on the monolithic structure due to the disposed state of the internal signal electrodes and grounding causes insufficient or excessive sintering, and is a great factor leading to fluctuations in the DC resistance.
SUMMARY OF THE INVENTION
In order to overcome the problems described above, preferred embodiments of the present invention provide a highly reliable feedthrough type three-terminal electronic component having a monolithic structure including internal signal electrodes and internal ground electrodes stacked so as to face one another across a dielectric layer, wherein the sintering state of the monolithic structure is uniform and DC resistance is very small.
According to a first preferred embodiment of the present invention, a feedthrough type three-terminal electronic component includes a monolithic structure having one or more pairs of an internal signal electrode and an internal ground electrode stacked so as to face one another across a dielectric layer, external signal electrodes communicating with extension portions of the internal signal electrodes and disposed on both end surfaces of the monolithic structure, and an external ground electrode communicating with extension portions of the internal ground electrodes and disposed on both side surfaces of the monolithic structure, wherein internal dummy electrodes, which essentially do not contribute to electrostatic capacity formation, are disposed in at least one of: (a) a region defined by both side portions of the internal signal electrodes and the external ground electrode provided on both side surfaces of the monolithic structure, viewing the monolithic structure in planar fashion; and (b) a region defined by both side portions of the internal ground electrodes and the external signal electrodes provided on both side surfaces of the monolithic structure, viewing the monolithic structure in planar fashion.
Disposing internal dummy electrodes which essentially do not contribute to electrostatic capacity formation in at least one of a region defined by both side portions of internal signal electrodes and the external ground electrode provided on both side surfaces of the monolithic structure, viewing the monolithic structure in planar fashion, and a region defined by both side portions of internal ground electrodes and external signal electrodes provided on both side surfaces of the monolithic structure, viewing the monolithic structure in planar fashion, suppresses irregularities in the concentration of internal electrodes disposed within the monolithic structure and makes the sintering state of internal electrodes at the time of baking the monolithic structure uniform, thereby enabling irregularities in the resistance of internal electrodes to be minimized and prevented.
That is, with the feedthrough type three-terminal electronic component according to preferred embodiments of the present invention, there are few irregularities in the concentration of internal electrodes, imbalance in the state of disposal of internal electrodes in the monolithic structure formed by alternately stacking internal signal electrodes and internal ground electrodes across dielectric layers (ceramic green sheets) and compressing in the manufacturing process is prevented from occurring, thereby preventing irregularities in the compression state and making the sintering state uniform. Accord

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