Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Reexamination Certificate
2006-03-14
2006-03-14
Ngo, Hung V. (Department: 2831)
Electricity: conductors and insulators
Boxes and housings
Hermetic sealed envelope type
C257S699000, C257S708000, C607S116000
Reexamination Certificate
active
07012192
ABSTRACT:
A terminal assembly for active implantable medical devices includes a structural pad, in the form of a substrate or attached wire bond pad, for convenient attachment of wires from the circuitry inside the implantable medical device.
REFERENCES:
patent: 2756375 (1956-07-01), Peck
patent: 3235939 (1966-02-01), Rodriguez et al.
patent: 3538464 (1970-11-01), Walsh
patent: 3920888 (1975-11-01), Barr
patent: 4083022 (1978-04-01), Nijman
patent: 4144509 (1979-03-01), Boutros
patent: 4148003 (1979-04-01), Colburn et al.
patent: 4152540 (1979-05-01), Duncan et al.
patent: 4220813 (1980-09-01), Kyle
patent: 4247881 (1981-01-01), Coleman
patent: 4314213 (1982-02-01), Wakino
patent: 4339231 (1982-07-01), Conery et al.
patent: 4352951 (1982-10-01), Kyle
patent: 4362792 (1982-12-01), Bowsky et al.
patent: 4424551 (1984-01-01), Stevenson et al.
patent: 4456786 (1984-06-01), Kyle
patent: 4737601 (1988-04-01), Gartzke
patent: 4741710 (1988-05-01), Hogan et al.
patent: 4897711 (1990-01-01), Blonder et al.
patent: 5032692 (1991-07-01), DeVolder
patent: 5070605 (1991-12-01), Daglow et al.
patent: 5142430 (1992-08-01), Anthony
patent: 5333095 (1994-07-01), Stevenson et al.
patent: 5440447 (1995-08-01), Shipman et al.
patent: 5539611 (1996-07-01), Hegner et al.
patent: 5650759 (1997-07-01), Hittman et al.
patent: 5670063 (1997-09-01), Hegner et al.
patent: 5751539 (1998-05-01), Stevenson et al.
patent: 5759197 (1998-06-01), Sawchuk et al.
patent: 5825608 (1998-10-01), Duva et al.
patent: 5836992 (1998-11-01), Thompson et al.
patent: 5867361 (1999-02-01), Wolf et al.
patent: 5870272 (1999-02-01), Seifried et al.
patent: 5905627 (1999-05-01), Brendel et al.
patent: 5959829 (1999-09-01), Stevenson et al.
patent: 5973906 (1999-10-01), Stevenson et al.
patent: 6008980 (1999-12-01), Stevenson et al.
patent: 6031710 (2000-02-01), Wolf et al.
patent: 6034424 (2000-03-01), Fujimura et al.
patent: 6414835 (2002-07-01), Wolf et al.
patent: 6459931 (2002-10-01), Hirschman
patent: 6459935 (2002-10-01), Piersma
patent: 6557635 (2003-05-01), Nguyen et al.
patent: 6844023 (2005-01-01), Schulman et al.
Dr. Gary Ewell, “A Capacitor's Inductance”, Capacitor and Resistor Technology Symposium (CARTS-Europe), Lisbon, Portugal, Oct. 19-22, 1999.
Brendel Richard L.
Frysz Christine
Hussein Haytham
Knappen Scott
Stevenson Robert A.
Kelly Lowry & Kelley LLP
Ngo Hung V.
LandOfFree
Feedthrough terminal assembly with lead wire bonding pad for... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Feedthrough terminal assembly with lead wire bonding pad for..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Feedthrough terminal assembly with lead wire bonding pad for... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3579306