Feedthrough interconnection assembly

Electricity: conductors and insulators – Anti-inductive structures

Reexamination Certificate

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C333S246000, C333S260000

Reexamination Certificate

active

06888061

ABSTRACT:
The present invention relates to optimization of communication equipment with respect to size and undesired signal interference. To this aim a ceramic feedthrough interconnection assembly is proposed in order to transport an electrical information signal to and from a communication capsule. In addition to at least one signal lead (103a,103b) for communicating an electrical information signal, the assembly contains at least one auxiliary lead and a shield (103c,103d,104, 104a,104b,104f) that electrically shields the at least one signal lead (103a,103b) from the at least one auxiliary lead. The shield (103c,103d,104, 104a,104b,104f) has such dimensions (d1, d2) and is positioned at such distance (d3, d4, d12) from the at least one signal lead (103a,103b) that the electrical information signal experiences a well-defined and substantially constant impedance in the assembly. This in turn, minimizes the risk of undesired signal reflections. At the same time the assembly allows a high lead density, i.e. short distances between the leads.

REFERENCES:
patent: 4873566 (1989-10-01), Hokanson et al.
patent: 4922325 (1990-05-01), Smeltz, Jr.
patent: 5406235 (1995-04-01), Hayashi
patent: 5428327 (1995-06-01), Bahl
patent: 5923234 (1999-07-01), Holzman et al.
patent: 2305954 (2000-10-01), None

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