Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1999-06-04
2000-07-25
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361704, 361709, 361712, 361713, 361715, 361719, 361720, 361818, 361829, 361831, 174 35R, 174 35OC, 174 51, 174 163, 165 802, 165 803, 16510433, H05K 114
Patent
active
060943505
ABSTRACT:
A manufacturing module for an RF feed-forward amplifier subsystem that allows for simple and cost-effective assembly, yet provides separate compartments for the different stages of the subsystem, with low RF leakage between the compartments is disclosed. The manufacturing module comprises a printed circuit board having one or more circuit trace layers, and ground planes covering a substantial portion of the top and bottom surfaces. The printed circuited board also has numerous plated-through holes electrically connecting the top and bottom ground planes. The circuit board is sandwiched between a heatsink having a flat upper surface and a machined enclosure having an outer wall and inner divider walls. The plated-through holes, space less than 1/10 wavelength of module's highest carrier frequency apart, serve to electrically connect the heatsink to the machined enclosure, thus creating separate compartments with low RF leakage.
REFERENCES:
patent: 4658334 (1987-04-01), McSparran et al.
patent: 5107404 (1992-04-01), Tam
patent: 5250845 (1993-10-01), Runyan
patent: 5566055 (1996-10-01), Salvi, Jr.
patent: 5977826 (1999-11-01), Behan et al.
AML Communications, Inc.
Arant Gene W.
Baker Larry D.
Dinh Tuan
Picard Leo P.
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