Feedback loop for selective conditioning of chemical mechanical

Details Feedback loop for selective conditioning of chemical mechanical Feedback loop for selective conditioning of chemical mechanical

1997-12-18

2000-09-05

Banks, Derris Holt

Abrading

Precision device or process - or with condition responsive...

Computer controlled

451 56, 451443, B24B 4900, B24B 5100

Patent

active

061134627

ABSTRACT:
An improved method and apparatus for Chemical Mechanical Polishing (CMP) in integrated circuit processing utilizes a film measurement feedback loop for progressively optimizing the polishing pad conditioning recipe. By utilizing this invention, non-uniform pad wearing and elastic property variations are substantially corrected, and Within-Wafer-Non-Uniformity (WIWNU) is minimized.

REFERENCES:
patent: 34425 (1862-02-01), Schultz
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patent: 5212910 (1993-05-01), Breivogel et al.
patent: 5216843 (1993-06-01), Breivogel et al.
patent: 5308438 (1994-05-01), Cote et al.
patent: 5421769 (1995-06-01), Schultz et al.
patent: 5664987 (1997-09-01), Renteln
patent: 5791969 (1998-08-01), Lund
Article entitled "Selective Conditioning And Pad Degradation Studies On Interlayer Dielectric Films"; K. Achhuthan et al.; CMP-MIC Conference; Feb. 22-23, 1996.

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