Features in substrates and methods of forming

Details Features in substrates and methods of forming Features in substrates and methods of forming

2007-05-11

2010-11-16

Norton, Nadine G (Department: 1713)

Etching a substrate: processes

Forming or treating thermal ink jet article

C029S890100

Reexamination Certificate

active

07833426

ABSTRACT:
The described embodiments relate to features in substrates and methods of forming same. One exemplary embodiment can be a microdevice that includes a substrate extending between a first substrate surface and a generally opposing second substrate surface, and at least one feature formed into the first surface along a bore axis that is not transverse to the first surface.

REFERENCES:
patent: 4959119 (1990-09-01), Lantzer
patent: 5160577 (1992-11-01), Deshpande et al.
patent: 5811019 (1998-09-01), Nakayama et al.
patent: 5841452 (1998-11-01), Silverbrook et al.
patent: 5999303 (1999-12-01), Drake
patent: 6130693 (2000-10-01), Ims et al.
patent: 6273553 (2001-08-01), Kim et al.
patent: 6305782 (2001-10-01), Kishima et al.
patent: 6368515 (2002-04-01), Kaminishi et al.
patent: 6412921 (2002-07-01), Manini
patent: 6489084 (2002-12-01), Pidwerbecki et al.
patent: 6497472 (2002-12-01), Sharma et al.
patent: 6513903 (2003-02-01), Sharma et al.
patent: 6563079 (2003-05-01), Umetsu et al.
patent: 6572215 (2003-06-01), Sharma
patent: 6573474 (2003-06-01), Loringer
patent: 6592205 (2003-07-01), Beerling et al.
patent: 6962402 (2005-11-01), Silverbrook
patent: 7299151 (2007-11-01), Braun et al.
patent: 2003/0117449 (2003-06-01), Cahill et al.
patent: 2003/0179258 (2003-09-01), Freire et al.
patent: 0724961 (1996-08-01), None
patent: 1024005 (1998-11-01), None
patent: 2384752 (2003-08-01), None
patent: 08-267754 (1996-10-01), None
patent: 09-272207 (1997-10-01), None
patent: 10-175316 (1998-06-01), None
patent: 2004-082468 (2004-03-01), None
patent: 2004082468 (2004-03-01), None
patent: WO 02/076666 (2002-10-01), None
Drake D J et al.; “Silicon Etched Reservoir for Bubble Control” Xerox Disclosure Journal, Xerox Corp. vol. 23 No. 5 Sep. 1998 pp. 219-221.
European Search Report for Application No. EP 08075905. Report issued Feb. 13, 2009.

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