Fe-Ni-Cu leadframe

Details Fe-Ni-Cu leadframe Fe-Ni-Cu leadframe

1984-03-26

1986-08-05

Larkins, William D.

357 67, 357 72, 75125, H01L 2954, H01L 2328, H01L 2350

Patent

active

046046429

ABSTRACT:
What is disclosed is a semiconductor apparatus comprises a semiconductor element, a pair of in-line electrode leads having a mounting island supporting the semiconductor element and a molded housing of resin compound. The electrode leads and mounting island are made of an alloy having a thermal expansion coefficient in the range of about 7.times.10.sup.-6 1/C.degree. to about 14.times.10.sup.-6 1/C.degree.. Thus, when the device is subjected to temperature variations, there is little warpage or cracking in the device.

REFERENCES:
patent: 1016549 (1912-02-01), Clamer
patent: 3600144 (1971-08-01), Csakvary
patent: 4258381 (1981-03-01), Inaba
Properties and Selection: Stainless Steel Tool Materials and Special Purpose Metals, Metals Handbook, Ninth Edition, vol. 3, Copyright 1980, by the American Society for Metals, pp. 792-793.
S. P. Zarlingo et al., "Leadframe Materials for Packaging Semiconductors", Semiconductor International, Sep., 1982, pp. 111-124.

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