Fault tolerant selection of die on wafer

Details Fault tolerant selection of die on wafer Fault tolerant selection of die on wafer

1996-10-31

1999-11-30

Nguyen, Vinh P.

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

324765, G01R 3128

Patent

active

059949120

ABSTRACT:
A semiconductor wafer is manufactured to include plural integrated circuit dies and plural probe area pads separate from the integrated circuit dies. The wafer also includes die selector circuits separate from the integrated circuit dies and the probe area pads. There is one selector circuit for each die. Each selector circuit produces a mode signal electrically connected to a mode bond pad of that one die. Each die selector circuit has at least a pair of I/O terminals bi-directionally electrically connected in series to at least two probe area pads.

REFERENCES:
patent: 4339710 (1982-07-01), Hapke
patent: 4612499 (1986-09-01), Andresen et al.
patent: 4743841 (1988-05-01), Takeuchi
patent: 4956602 (1990-09-01), Parrish
patent: 5012185 (1991-04-01), Ohfuji
patent: 5241266 (1993-08-01), Ahmad et al.
patent: 5278494 (1994-01-01), Obigane
patent: 5279975 (1994-01-01), Devereaux et al.
patent: 5286656 (1994-02-01), Keown et al.
patent: 5291025 (1994-03-01), Smith
patent: 5313158 (1994-05-01), Joosten et al.
patent: 5334857 (1994-08-01), Mennitt et al.
patent: 5366906 (1994-11-01), Wojnarowksi et al.
patent: 5389556 (1995-02-01), Rostoker et al.
patent: 5389873 (1995-02-01), Ishii et al.
patent: 5391984 (1995-02-01), Worley
patent: 5539325 (1996-07-01), Rostoker et al.

Affiliated with

Also associated with

Rating

Fault tolerant selection of die on wafer does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Fault tolerant selection of die on wafer, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Fault tolerant selection of die on wafer will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1677419