Electricity: electrical systems and devices – Electrostatic capacitors – With protection or compensating means
Reexamination Certificate
2011-03-22
2011-03-22
Ha, Nguyen T (Department: 2835)
Electricity: electrical systems and devices
Electrostatic capacitors
With protection or compensating means
C361S272000, C361S278000, C361S277000, C361S283100, C361S292000
Reexamination Certificate
active
07911761
ABSTRACT:
The present invention provides compliant/stretchable electroactive materials and devices made from those materials which exhibit fault-tolerant properties, i.e., self-healing/clearing properties. The present invention also provides systems, which incorporate the subject materials and/or devices, as well as methods of fabricating the subject materials and devices.
REFERENCES:
patent: 4326762 (1982-04-01), Hockenbrock et al.
patent: 4433359 (1984-02-01), Hamabe et al.
patent: 4434452 (1984-02-01), Hamabe et al.
patent: 5305178 (1994-04-01), Binder et al.
patent: 5636100 (1997-06-01), Zheng et al.
patent: 5696663 (1997-12-01), Unami et al.
patent: 5717563 (1998-02-01), MacDougall et al.
patent: 6111743 (2000-08-01), Lavene
patent: 6184044 (2001-02-01), Sone et al.
patent: 6316084 (2001-11-01), Claus et al.
patent: 6339527 (2002-01-01), Farooq et al.
patent: 6366193 (2002-04-01), Duggal et al.
patent: 6388553 (2002-05-01), Shea et al.
patent: 6532145 (2003-03-01), Carlen et al.
patent: 6631068 (2003-10-01), Lobo
patent: 7008838 (2006-03-01), Hosking et al.
patent: 7092238 (2006-08-01), Saito et al.
patent: 7099141 (2006-08-01), Kaufman et al.
patent: 7104146 (2006-09-01), Benslimane et al.
patent: 7298603 (2007-11-01), Mizuno et al.
patent: 7394641 (2008-07-01), Won et al.
patent: 7436646 (2008-10-01), Delince et al.
Begley, M. et al., “The electro-mechanical response of highly compliant substrates and thin stiff films with periodic cracks,”International Journal of Solids and Structures, 42: 5259-5273, 2005.
Boyle, W. et al., “Departure from Paschen's law of breakdown in gases,”The Physical Review, Second Series, 97(2): 255-259, 1955.
Delille, R. et al., “Novel Compliant Electrodes Based on Platinum Salt Reduction,”Smart Structures and Materials 2006: Electroactive Polymer Actuators and Devices(EAPAD), edited by Yoseph Bar-Cohen, Proceedings of SPIE, 6168(61681Q), 2006.
Hansen, G., “High Aspect Ratio Sub-Micron and Nano-scale Metal Filaments,”SAMPE Journal,41(2): 1-11, 2005.
Lacour, S. et al., “Mechanisms of reversible stretchability of thin metal films on elastomeric substrates,”Applied Physics Letters 88, 204103, 2006.
Lacour, S. et al., “Stretchable interconnects for elastic electronic surfaces,”Proceedings of the IEEE on Flexible Electronics Technology, 93(8): 1459-1467, 2005.
Reed, C. et al., “The Fundamentals of Aging in HV Polymer-film Capacitors,”IEEE Transactions on Dielectrics and Electrical Insulation, 1(5): 904-922, 1994.
Sokolova, M. et al., “Influence of a Bias Voltage on the Characteristics of Surface Discharges in Dry Air,”Plasma Processes and Polymers, 2: 162-169, 2005.
Standard Test Methods for Rubber Deterioration—Cracking in an Ozone Controlled Environment,ASTM International, D 1149-07.
Yoshio, O., “Ablation Characteristics of Silicone Insulation,”Journal of Polymer Science: Part A: Polymer Chemistry, 36: 233-239, 1998.
Yuan, W. et al., “New Electrode Materials for Dielectric Elastomer Actuators,”Proc. SPIE, 6524(65240N), 2007.
Biggs Silmon James
Senesky Matthew Kurt
Bayer MaterialScience AG
Cheung Noland J.
Ha Nguyen T
Mrozinski, Jr. John E.
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