Fatty amides prepared by reacting dicarboxylic acids, polyoxyalk

Compositions – Fluent dielectric – N-containing

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Details

252174, 25217421, 252DIG16, 564138, 564160, C11D 172, C11D 332, C11D 1314, C07C23102

Patent

active

051397064

ABSTRACT:
Surfactant composition prepared by reacting dicarboxylic acids and esters thereof, such as adipic acid, diethyl oxalate, etc.; a polyoxyalkyleneamine residue, such as an alkylene glycol diamine bottoms product, and fatty acids and esters thereof, such as tallow acid or coconut acid, are described. These nonionic surfactant compositions are useful for preparing surfactant bars, or other molded or shaped articles such as toys.

REFERENCES:
patent: 3043778 (1962-07-01), Kelly
patent: 3383320 (1968-05-01), Bell, Jr.
patent: 3563902 (1971-02-01), Schmadel et al.
patent: 3625903 (1971-12-01), Davies
patent: 3654167 (1972-04-01), Akrongold et al.
patent: 3663444 (1972-05-01), Schmadel
patent: 3882090 (1975-05-01), Fagerburg et al.
patent: 4201743 (1980-05-01), Perla et al.
patent: 4438010 (1984-05-01), Lindauer et al.
patent: 4453909 (1984-06-01), Lindauer et al.
patent: 4515707 (1985-05-01), Brooks
patent: 4521541 (1985-06-01), Rutherford
patent: 4735746 (1988-04-01), Speranza et al.
patent: 4795581 (1989-01-01), Nieh et al.
patent: 4828757 (1989-05-01), Naylor et al.
patent: 4946618 (1990-08-01), Knochel et al.

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