Fatigue-resistant lead-free alloy

Details Fatigue-resistant lead-free alloy Fatigue-resistant lead-free alloy

1998-04-03

1999-08-17

Ip, Sikyin

Metal treatment

Stock

420560, 228 563, C22C 700, C22C 1300

Patent

active

059388625

ABSTRACT:
A lead-free solder alloy suitable for forming solder joints of a surface-mount integrated circuit device, such as a flip chip. The solder alloy has a sufficiently low liquidus temperature to achieve desirable reflow properties at temperatures of 240.degree. C. and less, and is therefore compatible with integrated circuit processes. The solder alloy has a sufficiently high solidus temperature to ensure that solder joints formed with the alloy exhibit suitable mechanical properties at application temperatures up to 150.degree. C. when mounting a component to a laminate substrate. The solder alloy generally contains, in weight percent, about 7 to about 11% indium, about 2.5 to about 3.5% silver, and about 0.5 to about 1.5% copper, the balance tin and incidental impurities.

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patent: 5520752 (1996-05-01), Lucey, Jr. et al.
patent: 5527628 (1996-06-01), Anderson et al.

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