Fast-sweep growth method for growing layers using liquid phase e

Metal treatment – Process of modifying or maintaining internal physical... – Chemical-heat removing or burning of metal

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148172, 427 87, H01L 21208

Patent

active

041429249

ABSTRACT:
A uniform and thin layer of a semiconductor is grown on a semiconductor substrate by an improved liquid phase epitaxy growth method. The growth solution is supercooled and is pushed rapidly over the substrate on which the layer of solute is grown. In GaAs the amount of supercooling is typically 3.degree. to 5.degree. C. and a constant thickness ultra-thin layer (about 0.18 microns) is grown on top of a GaAs substrate.

REFERENCES:
patent: 3950195 (1976-04-01), Rode et al.
patent: 3981764 (1976-09-01), Ito et al.

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