Metal working – Barrier layer or semiconductor device making
Reexamination Certificate
2007-06-05
2007-06-05
Toledo, Fernando L. (Department: 2823)
Metal working
Barrier layer or semiconductor device making
C438S166000, C374S133000
Reexamination Certificate
active
11103144
ABSTRACT:
The present invention is directed to an apparatus and process for heating and cooling semiconductor wafers in thermal processing chambers. In particular, the apparatus of the present invention includes a cooling device for actively cooling the wafers after the wafers have been heated. During use, the cooling device can be movable towards and away from a wafer placed in the chamber for selectively cooling the wafer at desired times. In an alternative embodiment, a gas can be directed towards the wafer for rapidly reducing the temperature of the wafer at the completion of the process. Alternatively, the wafer can be lowered to close proximity of a cooling member to achieve active and selective cooling.
REFERENCES:
patent: 3862397 (1975-01-01), Anderson et al.
patent: 3895967 (1975-07-01), Anthony et al.
patent: 4450652 (1984-05-01), Walsh
patent: 4724621 (1988-02-01), Hobson et al.
patent: 4747928 (1988-05-01), Takahashi et al.
patent: 4811493 (1989-03-01), Burgio, Jr.
patent: 4836138 (1989-06-01), Robinson et al.
patent: 4857689 (1989-08-01), Lee
patent: 4863547 (1989-09-01), Shidahara et al.
patent: 4914276 (1990-04-01), Blair
patent: 4924073 (1990-05-01), Chiba
patent: 4949783 (1990-08-01), Lakios et al.
patent: 4956538 (1990-09-01), Moslehi
patent: 5002010 (1991-03-01), Weinberg
patent: 5018616 (1991-05-01), Johnson et al.
patent: 5033407 (1991-07-01), Mizuno et al.
patent: 5060354 (1991-10-01), Chizinsky
patent: 5108792 (1992-04-01), Anderson et al.
patent: 5113929 (1992-05-01), Nakagawa et al.
patent: 5129360 (1992-07-01), Ahern et al.
patent: 5156820 (1992-10-01), Wong et al.
patent: 5160545 (1992-11-01), Maloney et al.
patent: 5177878 (1993-01-01), Visser
patent: 5181556 (1993-01-01), Hughes
patent: 5199483 (1993-04-01), Bahng
patent: 5226732 (1993-07-01), Nakos et al.
patent: 5228501 (1993-07-01), Tepman et al.
patent: 5248370 (1993-09-01), Tsui et al.
patent: 5252366 (1993-10-01), Ahern et al.
patent: 5287914 (1994-02-01), Hughes
patent: 5290381 (1994-03-01), Nozawa et al.
patent: 5300453 (1994-04-01), Okamura et al.
patent: 5345999 (1994-09-01), Hosokawa
patent: 5356476 (1994-10-01), Foster et al.
patent: 5372648 (1994-12-01), Yamamoto et al.
patent: 5414244 (1995-05-01), Imahashi
patent: 5431700 (1995-07-01), Sloan
patent: 5436172 (1995-07-01), Moslehi
patent: 5443997 (1995-08-01), Tsui et al.
patent: 5449883 (1995-09-01), Tsuruta
patent: 5458687 (1995-10-01), Shichida et al.
patent: 5478401 (1995-12-01), Tsunekawa et al.
patent: 5520742 (1996-05-01), Ohkase
patent: 5597458 (1997-01-01), Sanchez, Jr. et al.
patent: 5609689 (1997-03-01), Kato et al.
patent: 5620560 (1997-04-01), Akimoto et al.
patent: 5660472 (1997-08-01), Peuse et al.
patent: 5662469 (1997-09-01), Okase et al.
patent: 5673750 (1997-10-01), Tsubone et al.
patent: 5743643 (1998-04-01), Gronet et al.
patent: 5770515 (1998-06-01), Meng et al.
patent: 5778968 (1998-07-01), Hendrickson et al.
patent: 5781693 (1998-07-01), Ballance et al.
patent: 5810933 (1998-09-01), Mountsier et al.
patent: 5814365 (1998-09-01), Mahawili
patent: 5820942 (1998-10-01), Singh et al.
patent: 5834068 (1998-11-01), Chern et al.
patent: 5846375 (1998-12-01), Gilchrist et al.
patent: 5874711 (1999-02-01), Champetier et al.
patent: 5881208 (1999-03-01), Geyling et al.
patent: 5891790 (1999-04-01), Keller et al.
patent: 5902494 (1999-05-01), Gupta et al.
patent: 5920797 (1999-07-01), Ballance et al.
patent: 5926742 (1999-07-01), Thakur et al.
patent: 5930456 (1999-07-01), Vosen
patent: 5937142 (1999-08-01), Moslehi et al.
patent: 5937541 (1999-08-01), Weigand et al.
patent: 5944857 (1999-08-01), Edwards et al.
patent: 5960158 (1999-09-01), Gat et al.
patent: 5960555 (1999-10-01), Deaton et al.
patent: 5965047 (1999-10-01), Blersch et al.
patent: 5970214 (1999-10-01), Gat
patent: 5970382 (1999-10-01), Shah
patent: 5980637 (1999-11-01), Singh et al.
patent: 5990016 (1999-11-01), Kim et al.
patent: 5997175 (1999-12-01), Champetier et al.
patent: 6018616 (2000-01-01), Schaper
patent: 6027244 (2000-02-01), Champetier et al.
patent: 6034357 (2000-03-01), Guardado
patent: 6056434 (2000-05-01), Champetier
patent: 6073366 (2000-06-01), Aswad
patent: 6075922 (2000-06-01), Tay et al.
patent: 6097005 (2000-08-01), Akimoto
patent: 6100506 (2000-08-01), Colelli, Jr. et al.
patent: 6105274 (2000-08-01), Ballantine et al.
patent: 6107608 (2000-08-01), Hayes
patent: 6108937 (2000-08-01), Raaijmakers
patent: 6114662 (2000-09-01), Guidotti et al.
patent: 6133550 (2000-10-01), Griffiths et al.
patent: 6160242 (2000-12-01), Guardado
patent: 6174651 (2001-01-01), Thakur
patent: 6198074 (2001-03-01), Savas
patent: 6200023 (2001-03-01), Tay et al.
patent: 6200634 (2001-03-01), Johnsgard et al.
patent: 6203620 (2001-03-01), Moslehi
patent: 6204484 (2001-03-01), Tay et al.
patent: 6209220 (2001-04-01), Raaijmakers
patent: 6209480 (2001-04-01), Moslehi
patent: 6210484 (2001-04-01), Hathaway
patent: 6215106 (2001-04-01), Boas et al.
patent: 6222990 (2001-04-01), Guardado et al.
patent: 6232580 (2001-05-01), Sandhu
patent: 6235656 (2001-05-01), Clarke
patent: 6238588 (2001-05-01), Collins et al.
patent: 6239038 (2001-05-01), Wen
patent: 6280790 (2001-08-01), White et al.
patent: 6281141 (2001-08-01), Das et al.
patent: 6293696 (2001-09-01), Guardado
patent: 6307184 (2001-10-01), Womack et al.
patent: 6310328 (2001-10-01), Gat
patent: 6359263 (2002-03-01), Tay et al.
patent: 6387182 (2002-05-01), Horie et al.
patent: 6403923 (2002-06-01), Tay et al.
patent: 6408537 (2002-06-01), Aswad
patent: 6414276 (2002-07-01), Babikian
patent: 6423947 (2002-07-01), Womack
patent: 6506691 (2003-01-01), Cook et al.
patent: 6514876 (2003-02-01), Thakur et al.
patent: 6559424 (2003-05-01), O'Carroll et al.
patent: 6610967 (2003-08-01), Gat
patent: 6638876 (2003-10-01), Levy et al.
patent: 6717158 (2004-04-01), Gat et al.
patent: 6727474 (2004-04-01), Gat
patent: 6770146 (2004-08-01), Koren et al.
patent: 6771895 (2004-08-01), Gat et al.
patent: 6797312 (2004-09-01), Kong et al.
patent: 6808758 (2004-10-01), Thakur
patent: 6835914 (2004-12-01), Timans
patent: 2002/0000194 (2002-01-01), Clarke
patent: 2002/0104205 (2002-08-01), Goodwin
patent: 2002/0121242 (2002-09-01), Minami et al.
patent: 2002/0137311 (2002-09-01), Timans
patent: 2003/0031793 (2003-02-01), Chang et al.
patent: 2003/0124820 (2003-07-01), Johnsgard et al.
patent: 2003/0209326 (2003-11-01), Lee et al.
patent: 2003/0235983 (2003-12-01), Li et al.
patent: 2003/0236642 (2003-12-01), Timans
patent: 2004/0018008 (2004-01-01), Koren et al.
patent: 2004/0025787 (2004-02-01), Selbrede et al.
patent: 2004/0040508 (2004-03-01), Shajii et al.
patent: 2004/0058557 (2004-03-01), Eisele et al.
patent: 2005/0006916 (2005-01-01), Mantz et al.
patent: 2005/0008351 (2005-01-01), Gat et al.
patent: 0780855 (1987-06-01), None
patent: 0451740 (1991-10-01), None
patent: 0454054 (1991-10-01), None
patent: 0695922 (1996-02-01), None
patent: 0821085 (1998-01-01), None
patent: 0829904 (1998-03-01), None
patent: 59275987 (1986-07-01), None
patent: 62035517 (1988-05-01), None
patent: WO0145501 (2001-06-01), None
patent: WO0145501 (2001-06-01), None
patent: WO0046840 (2002-08-01), None
U.S. Appl. No. 09/527,873, filed Mar. 17, 2000, Shooshtarian et al., Localized Heating And Cooling Of Substrates.
Abstract of Japanese Patent No. JP2139916, May 29, 1990.
Abstract of Japanese Patent No. JP2301173, Dec. 13, 1990.
Abstract of Japanese Patent No. JP3259511, Nov. 19, 1991.
Abstract of Japanese Patent No. JP4058530, Feb. 25, 1992.
Abstract of Japanese Patent No. JP4176121, Jun. 23, 1992.
Abstract of Japanese Patent No. JP04266015, Sep. 22, 1992.
Abstract of Japanese Patent No. JP61142743, Jun. 30, 1986.
Abstract of Japanese Patent No. JP61156814, Jul. 16, 1986.
Abstract of Japanese Patent No. JP63124528, May 28, 1988.
Abstract of Japanese Patent No. JP62205626, Sep. 10, 1987.
Abstract of Japanese Patent No. JP6235517, Aug. 23, 1994.
Abstract of Japanese Patent No. JP9306979, Nov. 28, 1997.
Dority & Manning P.A.
Mattson Technology Inc.
Toledo Fernando L.
LandOfFree
Fast heating and cooling apparatus for semiconductor wafers does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Fast heating and cooling apparatus for semiconductor wafers, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Fast heating and cooling apparatus for semiconductor wafers will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3831282