Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2005-05-31
2005-05-31
Nelms, David (Department: 2818)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
C156S089150
Reexamination Certificate
active
06900073
ABSTRACT:
An apparatus for flattening sintered ceramic electronic packaging substrates having opposing faces with undesired camber interleaves the substrates with spacers. At least one heating zone includes a heat transfer medium movable toward and away from the stack of interleaved ceramic substrates and spacers to apply a desired rate of heat by direct contact with or close proximity to sides of the stack. A plunger applies pressure to the stack in a direction normal to the faces of the substrates. At least one cooling zone includes a heat transfer medium movable toward and away from the stack to remove heat introduced in the heating zone by direct contact with or close proximity to sides of the stack. A reducing gas supply is operatively connected to the at least one heating zone and at least one cooling zone to supply gas to maintain a controlled reducing atmosphere within the apparatus.
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patent: 5932043 (1999-08-01), Bates et al.
patent: 6721163 (2004-04-01), Iwase et al.
Bezama Raschid J.
Weisman Renee L.
DeLio & Peterson LLC
Hoang Quoc
Peterson Peter W.
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