Fast data compression circuit for semiconductor memory chips inc

Excavating

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

371 275, G11C 2900

Patent

active

054426413

ABSTRACT:
A fast high-density data compression circuit adapted to semiconductor integrated circuits of the memory type including an ABIST unit. This circuit, which compares the data-out signals output by the memory unit with the expected data generated by the ABIST unit to deliver a signal on a cycle by cycle basis, which is indicative of the fail
o fail status of the memory unit.

REFERENCES:
patent: 5173906 (1992-12-01), Dreibelbis et al.
patent: 5313424 (1994-05-01), Adams et al.
"Dynamic Self-Repair Redundancy System" IBM Technical Disclosure Bulletin, vol. 34, #5, pp. 448-449, Oct. 1991.
Reddy et al. "A Data Compression Technique for Built in Self Test", IEEE Trans. on Computers vol. 37 No. 9 Sep. 1988 pp. 1151-1156.
Nagle et al. "Design for Testability and Built in Self Test: A Review" IEEE Trans. on Industrial Electronics, vol. 36, No. 2 May 1989 pp. 129-140.
Yan "Compact Testing with Intermediate Signature Analysis" 1991 IEEE VLSI for Symposium pp. 47-52.
Karpovsky et al. "Built in Self-Diagnostic by Space-Time Compression of Test Responses" IEEE VLSI Test Symposium 1992 pp. 149-154.
Gupta "Recent Advances in BIST" IEEE VLSI Test Symposium 1992 pp. 235-240.
Wu et al. "A Minimal Hardware Overhead BIST Data Compaction Scheme" ASIC Conference and Exhibit 1992 pp. 368-371.
Lampin et al. "Design and Application Trade-offs Between High-Density and High Speed ASICS" Computer Design-ICCD 1990 Int. Conf. pp. 269-272.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Fast data compression circuit for semiconductor memory chips inc does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Fast data compression circuit for semiconductor memory chips inc, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Fast data compression circuit for semiconductor memory chips inc will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2188563

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.