Fast damper diode and method

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357 20, 357 58, 357 88, 357 89, H01L 2992, H01L 2906, H01L 2912

Patent

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051191482

ABSTRACT:
An improved damper diode is obtained by replacing the usual step junction (P.sup.+ -Nu-N.sup.+) structure of the prior art with an epitaxial double sided Pi-Nu structure (i.e., P.sup.+ -Pi-Nu-N.sup.+) in which the thickness and impurity concentrations of the Pi and Nu regions are substantially equal and have a combined thickness about equal to the prior art Nu region for the same voltage. Improved transient response (TFR), better transient energy absorption capability (UIS) and lower forward transient turn-on peak over-shoot voltage (TOPO) is obtained for the same or higher reverse breakdown voltage (BVR), in the same or smaller die size.

REFERENCES:
patent: 3916427 (1975-10-01), Ying et al.
patent: 3945028 (1976-03-01), Krishna et al.
patent: 4274103 (1981-06-01), Yamamoto et al.
patent: 4587547 (1986-05-01), Amemiya et al.
patent: 4605948 (1986-08-01), Martinelli

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