Fast curing and storage stable thermoset polymer thick film comp

Compositions – Electrically conductive or emissive compositions – Elemental carbon containing

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252514, 252503, H01B 106

Patent

active

050572458

ABSTRACT:
A thermally curable polymer thick film compositions comprising, by weight:

REFERENCES:
patent: 4704231 (1987-11-01), Chung
patent: 4971726 (1990-11-01), Maeno et al.

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