Fast bonding electrically conductive composition and structures

Details Fast bonding electrically conductive composition and structures Fast bonding electrically conductive composition and structures

1995-09-12

1997-07-22

Yoon, Tae

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

At least one aryl ring which is part of a fused or bridged...

524780, 528 745, 528 77, 252512, 252514, C08K 310, H01B 102, C08G 1832

Patent

active

056504608

ABSTRACT:
Composition and method for a conductive interconnection composition in bonding relation with electronic components including combining and upon combining expressing from a mix tip onto conductive portions of electronic components a silver filled first side urethane resin precursor comprising an aliphatic isocyanato reagent and a silver filled second side urethane resin precursor comprising a polyol reagent immediately reactive with the first side precursor isocyanato reagent, the silver being present in the composition in an amount sufficient to conduct electricity to and from the electronic components.

REFERENCES:
patent: Re33761 (1991-12-01), Brauer et al.
patent: 4931479 (1990-06-01), Morgan
patent: 5061566 (1991-10-01), Morgan
patent: 5164473 (1992-11-01), Dormish et al.
patent: 5284888 (1994-02-01), Morgan
patent: 5385966 (1995-01-01), Hermansen et al.
patent: 5451629 (1995-09-01), Jacobs

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