Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1997-05-21
1999-09-14
Stephan, Steven L.
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
439493, 361777, 361749, 174261, 257786, H01R 909
Patent
active
059513047
ABSTRACT:
For providing multiple-conductor circuit interconnections where there is a lack of precise dimensional control, as in manufacturing flexible printed circuits used to make high density electrical interconnections between ultrasonic transducer elements and the probe cable in a medical ultrasound probe, connection pads are formed in fanout arrays, with the longitudinal axes of individual pads extending along radial lines from the center of a circle. The fanout arrays are formed within generally trapezoidal areas, each having two parallel opposite sides extending along respective parallel chords to accommodate significant variation in dimensions of the respective substrates being connected. Multiple-row connection pad arrays may be provided, each with a plurality of fanout arrays of connection pads that may be parallel to each other and positioned at respectively different distances from the center of the circle, or may be arranged around, and positioned at equal distances from, the center of the circle. If the circuit substrate is anisotropic, the connection pads are on curved pad-locating lines defined by y=Ax.sup..beta., where (x,y)=(0,0) defines the circle center, A is a proportionality constant for the respective pad-locating line, and .beta. is an anisotropy factor.
REFERENCES:
patent: 4055003 (1977-10-01), Sack
patent: 4789889 (1988-12-01), Morris et al.
patent: 4953005 (1990-08-01), Carlson et al.
patent: 5038251 (1991-08-01), Sugiyama et al.
patent: 5040069 (1991-08-01), Matsumoto et al.
patent: 5172472 (1992-12-01), Lindner et al.
patent: 5467779 (1995-11-01), Smith et al.
patent: 5469072 (1995-11-01), Williams et al.
patent: 5484186 (1996-01-01), Van Order et al.
patent: 5499444 (1996-03-01), Doane, Jr. et al.
patent: 5546279 (1996-08-01), Aota et al.
patent: 5558523 (1996-09-01), Coteus et al.
patent: 5818114 (1998-10-01), Pendse et al.
Rajendra D. Pendse, Rita N. Horner and Fan Kee Loh, "Radially Staggered Bonding Technology", Hewlett-Packard Journal, Dec. 1996, pp. 41-50.
Rita N. Horner, Rajendra D. Pendse, Fan Kee Loh, "Implementation of Pad Circuitry for Radially Staggered Bond Pad Arrangement", Hewlett-Packard Journal, Dec. 1996, pp. 51-54.
Lewandowski Robert Stephen
Wildes Douglas Glenn
General Electric Company
Snyder Marvin
Standig Barry M. L.
Stephan Steven L.
Stoner Douglas E.
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