Heat exchange – With retainer for removable article – Electrical component
Reexamination Certificate
1999-07-01
2001-05-22
Atkinson, Christopher (Department: 3743)
Heat exchange
With retainer for removable article
Electrical component
C165S080400, C165S185000, C257S714000, C361S700000, C062S003200
Reexamination Certificate
active
06234240
ABSTRACT:
TECHNICAL FIELD
This invention relates to cooling systems for computers and, more particularly, to such a system having a heat transfer device mounted on a computer component and communicating with a liquid coolant reservoir via first and second conduits, a radiator mounted on the outside of the computer housing and in heat exchanging contact with the reservoir, and mounting portions of the radiator onto which the computer power supply is directly mounted in heat exchanging contact with the radiator.
BACKGROUND OF THE INVENTION
It is well known that computers commonly include components that produce heat. Various types of cooling systems have been proposed for removing heat from the computer components to maintain the computer within operating temperature limits. The proposed systems include passive cooling systems and systems that employ gaseous and/or liquid coolants actively brought into heat transfer contact with the heat-generating components. There are a number of drawbacks associated with the presently known systems. These include noise and dust associated with systems having fans to create an airstream for cooling computer components or other elements (e.g., radiators) of the cooling system. They also include lack of sufficient cooling capacity or bulkiness and/or complexity resulting from efforts to increase cooling capacity.
The principal object of the present invention is to provide a cooling system for computers that avoids the drawbacks discussed above and is especially appropriate for use with small computers, including personal computers, workstations, servers, and small mainframes.
BRIEF SUMMARY OF THE INVENTION
The invention is directed toward a cooling system for a computer having a housing, a power supply, and at least one heat-producing component mounted inside the housing. According to an aspect of the invention, the cooling system comprises a heat transfer device having an outer surface in heat exchanging contact with a complementary outer surface of the component and an internal passageway extending between an inlet port and an outlet port. A radiator is mounted on the outside of the housing and has a plurality of heat transfer fins exposed to ambient air outside the housing. A reservoir is in heat exchanging contact with the radiator and extends into the housing. The reservoir has a casing, an inlet opening in the casing, and an outlet opening in the casing spaced from the inlet opening. A first conduit extends between the outlet port of the heat transfer device and the inlet opening of the reservoir. A second conduit extends between the outlet opening of the reservoir and the inlet port of the heat transfer device. The radiator has a mounting surface facing inwardly into the housing. The mounting surface is in direct heat exchanging contact with the power supply to allow heat produced by the power supply to be dissipated by the radiator.
The computer may include one or more heat-producing components. In the case of plural heat-producing components, the system may comprise a second heat transfer device having an outer surface in heat exchanging contact with a complementary outer surface of the second component. Like the first heat transfer device, the second device has an internal passageway extending between an inlet port and an outlet port. One of the conduits includes the internal passageway in the second heat transfer device. The heat-producing components may be various types of components. It is contemplated that in most applications of the invention the components will comprise at least one microprocessor.
The power supply may include a plurality of transistors. In such case, the preferred mounting arrangement for the power supply includes the mounting of the transistors directly on the mounting surface.
The heat transfer device may be in direct heat exchanging contact with the complementary outer surface of the component. Alternatively, a Peltier thermoelectric cooler may be positioned between the heat transfer device and the component. The Peltier cooler has a hot side and an opposite cold side. The cold side has an outer surface in heat exchanging contact with the complementary outer surface of the component. The outer surface of the heat transfer device is in heat exchanging contact with a complementary outer surface of the hot side. The system may further include additional arrangements of Peltier coolers and heat transfer devices mounted as described above to provide cooling of additional heat-producing components of the computer.
The cooling system of the invention has a number of advantages. The lack of a fan for moving air allows the system to operate essentially noise and dust free. The system has good cooling capacity and is highly versatile. The system may be installed either as part of original equipment or retrofitted into existing computers. Because of the relative simplicity and compact structure of the elements of the system, the system is especially well-adapted for use with small computers, such as personal computers, workstations, servers, and small mainframes. Whatever type of computer the system is installed in, the system provides reliable and low cost cooling.
These and other advantages and features will become apparent from the detailed description of the invention that follows.
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Atkinson Christopher
Pauly Joan H.
LandOfFree
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