Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate
2007-05-15
2007-05-15
Le, Thao X. (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With structure for mounting semiconductor chip to lead frame
C257S666000, C257SE23004
Reexamination Certificate
active
10971408
ABSTRACT:
A semiconductor package comprising a plurality of elongate leads which each have opposed inner and outer ends, opposed first and second surfaces, and a third surface which is disposed in opposed relation to the first surface and recessed relative to the second surface. The second surface of each lead is positioned in close proximity to the inner end thereof. The third surface of each lead extends to the outer end thereof. A semiconductor die is attached to portions of the first surfaces of at least some of the leads. The semiconductor die is itself electrically connected to at least some of the leads. A package body covers the semiconductor die and the leads such that the second surfaces of the leads are exposed in a bottom surface of the package body and the outer ends of the leads are exposed in respective side surfaces of the package body.
REFERENCES:
patent: 2596993 (1952-05-01), Gookin
patent: 3435815 (1969-04-01), Forcier
patent: 3734660 (1973-05-01), Davies et al.
patent: 3838984 (1974-10-01), Crane et al.
patent: 4054238 (1977-10-01), Lloyd et al.
patent: 4189342 (1980-02-01), Kock
patent: 4258381 (1981-03-01), Inaba
patent: 4289922 (1981-09-01), Devlin
patent: 4301464 (1981-11-01), Otsuki et al.
patent: 4332537 (1982-06-01), Slepcevic
patent: 4417266 (1983-11-01), Grabbe
patent: 4451224 (1984-05-01), Harding
patent: 4530152 (1985-07-01), Roche et al.
patent: 4541003 (1985-09-01), Otsuka et al.
patent: 4646710 (1987-03-01), Schmid et al.
patent: 4707724 (1987-11-01), Suzuki et al.
patent: 4727633 (1988-03-01), Herrick
patent: 4737839 (1988-04-01), Burt
patent: 4756080 (1988-07-01), Thorp, Jr. et al.
patent: 4812896 (1989-03-01), Rothgery et al.
patent: 4862245 (1989-08-01), Pashby et al.
patent: 4862246 (1989-08-01), Masuda et al.
patent: 4907067 (1990-03-01), Derryberry
patent: 4920074 (1990-04-01), Shimizu et al.
patent: 4935803 (1990-06-01), Kalfus et al.
patent: 4942454 (1990-07-01), Mori et al.
patent: 4987475 (1991-01-01), Schlesinger et al.
patent: 5018003 (1991-05-01), Yasunaga
patent: 5029386 (1991-07-01), Chao et al.
patent: 5041902 (1991-08-01), McShane
patent: 5057900 (1991-10-01), Yamazaki
patent: 5059379 (1991-10-01), Tsutsumi et al.
patent: 5065223 (1991-11-01), Matsuki et al.
patent: 5070039 (1991-12-01), Johnson et al.
patent: 5087961 (1992-02-01), Long et al.
patent: 5091341 (1992-02-01), Asada et al.
patent: 5096852 (1992-03-01), Hobson
patent: 5118298 (1992-06-01), Murphy
patent: 5122860 (1992-06-01), Kichuchi et al.
patent: 5134773 (1992-08-01), LeMaire et al.
patent: 5151039 (1992-09-01), Murphy
patent: 5157475 (1992-10-01), Yamaguchi
patent: 5157480 (1992-10-01), McShane et al.
patent: 5168368 (1992-12-01), Gow, 3rd et al.
patent: 5172213 (1992-12-01), Zimmerman
patent: 5172214 (1992-12-01), Casto
patent: 5175060 (1992-12-01), Enomoto et al.
patent: 5200362 (1993-04-01), Lin et al.
patent: 5200809 (1993-04-01), Kwon
patent: 5214845 (1993-06-01), King et al.
patent: 5216278 (1993-06-01), Lin et al.
patent: 5218231 (1993-06-01), Kudo
patent: 5221642 (1993-06-01), Burns
patent: 5250841 (1993-10-01), Sloan et al.
patent: 5252853 (1993-10-01), Michii
patent: 5258094 (1993-11-01), Furui et al.
patent: 5266834 (1993-11-01), Nishi et al.
patent: 5273938 (1993-12-01), Lin et al.
patent: 5277972 (1994-01-01), Sakumoto et al.
patent: 5278446 (1994-01-01), Nagaraj et al.
patent: 5279029 (1994-01-01), Burns
patent: 5281849 (1994-01-01), Singh Deo et al.
patent: 5294897 (1994-03-01), Notani et al.
patent: 5327008 (1994-07-01), Djennas et al.
patent: 5332864 (1994-07-01), Liang et al.
patent: 5335771 (1994-08-01), Murphy
patent: 5336931 (1994-08-01), Juskey et al.
patent: 5343076 (1994-08-01), Katayama et al.
patent: 5358905 (1994-10-01), Chiu
patent: 5365106 (1994-11-01), Watanabe
patent: 5381042 (1995-01-01), Lerner et al.
patent: 5391439 (1995-02-01), Tomita et al.
patent: 5406124 (1995-04-01), Morita et al.
patent: 5410180 (1995-04-01), Fujii et al.
patent: 5414299 (1995-05-01), Wang et al.
patent: 5417905 (1995-05-01), LeMaire et al.
patent: 5424576 (1995-06-01), Djennas et al.
patent: 5428248 (1995-06-01), Cha
patent: 5435057 (1995-07-01), Bindra et al.
patent: 5444301 (1995-08-01), Song et al.
patent: 5452511 (1995-09-01), Chang
patent: 5454905 (1995-10-01), Fogelson
patent: 5474958 (1995-12-01), Djennas et al.
patent: 5484274 (1996-01-01), Neu
patent: 5493151 (1996-02-01), Asada et al.
patent: 5508556 (1996-04-01), Lin
patent: 5517056 (1996-05-01), Bigler et al.
patent: 5521429 (1996-05-01), Aono et al.
patent: 5528076 (1996-06-01), Pavio
patent: 5534467 (1996-07-01), Rostoker
patent: 5539251 (1996-07-01), Iverson et al.
patent: 5543657 (1996-08-01), Diffenderfer et al.
patent: 5544412 (1996-08-01), Romero et al.
patent: 5545923 (1996-08-01), Barber
patent: 5581122 (1996-12-01), Chao et al.
patent: 5592019 (1997-01-01), Ueda et al.
patent: 5592025 (1997-01-01), Clark et al.
patent: 5594274 (1997-01-01), Suetaki
patent: 5595934 (1997-01-01), Kim
patent: 5604376 (1997-02-01), Hamburgen et al.
patent: 5608265 (1997-03-01), Kitano et al.
patent: 5608267 (1997-03-01), Mahulikar et al.
patent: 5625222 (1997-04-01), Yoneda et al.
patent: 5633528 (1997-05-01), Abbott et al.
patent: 5639990 (1997-06-01), Nishihara et al.
patent: 5640047 (1997-06-01), Nakashima
patent: 5641997 (1997-06-01), Ohta et al.
patent: 5643433 (1997-07-01), Fukase et al.
patent: 5644169 (1997-07-01), Chun
patent: 5646831 (1997-07-01), Manteghi
patent: 5650663 (1997-07-01), Parthasaranthi
patent: 5661088 (1997-08-01), Tessier et al.
patent: 5665996 (1997-09-01), Williams et al.
patent: 5673479 (1997-10-01), Hawthorne
patent: 5683806 (1997-11-01), Sakumoto et al.
patent: 5689135 (1997-11-01), Ball
patent: 5696666 (1997-12-01), Miles et al.
patent: 5701034 (1997-12-01), Marrs
patent: 5703407 (1997-12-01), Hori
patent: 5710064 (1998-01-01), Song et al.
patent: 5723899 (1998-03-01), Shin
patent: 5724233 (1998-03-01), Honda et al.
patent: 5726493 (1998-03-01), Yamashita
patent: 5736432 (1998-04-01), Mackessy
patent: 5745984 (1998-05-01), Cole, Jr. et al.
patent: 5753532 (1998-05-01), Sim
patent: 5753977 (1998-05-01), Kusaka et al.
patent: 5766972 (1998-06-01), Takahashi et al.
patent: 5770888 (1998-06-01), Song et al.
patent: 5776798 (1998-07-01), Quan et al.
patent: 5783861 (1998-07-01), Son
patent: 5801440 (1998-09-01), Chu et al.
patent: 5814877 (1998-09-01), Diffenderfer et al.
patent: 5814881 (1998-09-01), Alagaratnam et al.
patent: 5814883 (1998-09-01), Sawai et al.
patent: 5814884 (1998-09-01), Davis et al.
patent: 5817540 (1998-10-01), Wark
patent: 5818105 (1998-10-01), Kouda
patent: 5821457 (1998-10-01), Mosley et al.
patent: 5821615 (1998-10-01), Lee
patent: 5834830 (1998-11-01), Cho
patent: 5835988 (1998-11-01), Ishii
patent: 5844306 (1998-12-01), Fujita et al.
patent: 5856911 (1999-01-01), Riley
patent: 5859471 (1999-01-01), Kuraishi et al.
patent: 5866939 (1999-02-01), Shin et al.
patent: 5871782 (1999-02-01), Choi
patent: 5874784 (1999-02-01), Aoki et al.
patent: 5877043 (1999-03-01), Alcoe et al.
patent: 5886397 (1999-03-01), Ewer
patent: 5886398 (1999-03-01), Low et al.
patent: 5894108 (1999-04-01), Mostafazadeh et al.
patent: 5894165 (1999-04-01), Ma et al.
patent: 5897339 (1999-04-01), Song et al.
patent: 5900676 (1999-05-01), Kweon et al.
patent: 5903049 (1999-05-01), Mori
patent: 5903050 (1999-05-01), Thurairajaratnam et al.
patent: 5909053 (1999-06-01), Fukase et al.
patent: 5915998 (1999-06-01), Stidham et al.
patent: 5917242 (1999-06-01), Ball
patent: 5939779 (1999-08-01), Kim
patent: 5942794 (1999-08-01), Okumura et al.
patent: 5951305 (1999-09-01), Haba
patent: 5959356 (1999-09-01), Oh
patent: 5969426 (1999-10-01), Baba et al.
patent: 5973388 (1999-10-01), Chew et al.
patent: 5976912 (1999-11-01), Fukutomi et al.
patent: 5977613 (1999-11-01), Takata et al.
patent: 5977615 (1999-11-01), Yamaguchi et al.
patent: 5977630 (1999-11-01), Woodworth et al.
patent: 5981314 (1999-11-01), Glenn et al.
patent: 5986333 (1999-11-01), Nakamura
patent: 5986885 (1999-11-01), Wyland
patent: 6001671 (1999-12-01), Fjelstad
patent: 6013947 (2000-01-01), Lim
patent: 6018189 (2000-01-01), Mi
Amkor Technology Inc.
Hafiz Mursalin B.
Le Thao X.
Stetina Brunda Garred & Brucker
LandOfFree
Fan-in leadframe semiconductor package does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Fan-in leadframe semiconductor package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Fan-in leadframe semiconductor package will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3732548