Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
1999-12-27
2001-04-10
Picard, Leo P. (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S690000, C361S694000, C174S015100, C174S016100, C165S080300, C165S122000, C165S185000
Reexamination Certificate
active
06215659
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a fan housing in a computer enclosure, and particularly to a fan housing in a computer enclosure having an inclined end wall for attaching a fan thereto.
2. Description of Prior Art
Heat produced within the computer enclosure increases due to increase in operational speed as the computer industry develops, which may increase an internal temperature of the computer enclosure and reduce stability of the computer system. To encounter the problem, it is desirable to dissipate the heat quickly by a heat dissipating system to guarantee that the computer system may operate in its normal temperature range. This will assure the quality of data operation, storage and transfer.
A heat dissipating system generally includes a first fan within a power supply, a second fan attached to a central processing unit and a third fan attached to a bottom corner of the computer enclosure. A conventional fan housing for receiving the third fan forms a vertical end wall for fixing the third fan, thus the third fan draw air and horizontally flow through a bottom portion of a mother board. However, the central processing unit mounted proximate a central portion of the mother board is a main heat source in a computer enclosure. A conventional fan housing cannot make the third fan draw air to flow through the central processing unit, thereby reducing the efficiency of the third fan.
Thus, it is desired to provide an improved fan housing which increases the efficiency of the heat dissipation within the computer enclosure by adjusting the driving angle of the third fan.
SUMMARY OF THE INVENTION
Accordingly, an object of the present invention is to provide a fan housing to receive a fan for efficiently dissipating heat away from a heat generating element.
Second object of the present invention is to provide a fan housing having a single structure for receiving a fan.
Third object of the present invention is to provide a fan housing having a single structure for being readily assembled within a computer enclosure.
In a preferred embodiment of the present invention, a fan housing attached to a computer enclosure for receiving a fan comprises two side walls and an end wall connected between the two side walls. Each side wall has a fixing edge adapted for abutting against the computer enclosure. The end wall is inclined relative to a plane in which the fixing edges of the side walls lie and is adapted for engaging with the fan.
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patent: 5852547 (1998-12-01), Kitlas et al.
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patent: 6040981 (2000-03-01), Schmitt et al.
patent: 6061237 (2000-05-01), Sands et al.
Chervinsky Boris L.
Chung Wei Te
Hon Hai - Precision Ind. Co., Ltd.
Picard Leo P.
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