Family of different-sized demountable hybrid assemblies with mic

Details Family of different-sized demountable hybrid assemblies with mic Family of different-sized demountable hybrid assemblies with mic

1994-12-29

1995-06-20

Gensler, Paul

Wave transmission lines and networks

Long line elements and components

Strip type

257726, 257727, H01L 2332

Patent

active

054264057

ABSTRACT:
A family of modular hybrid assemblies with high frequency interconnections is effected by a high frequency circuit assembly attached to a motherboard. Each assembly comprises standardized conducting elements and customizable transitions and circuit regions. The customizable transitions can be placed anywhere along the conducting element and are capable of low and high frequency performance. Attachment of the assembly can be effected via a standardized clamping structure which compresses an elastomeric member upon the conducting elements or by bending the conducting elements and soldering on end to attachment sites on the motherboard. Each member of the family of modular hybrid assemblies provides a controlled impedance transition from a transmission line on the circuit assembly to a transmission line on the motherboard.

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