Facing targets sputtering device

Details Facing targets sputtering device Facing targets sputtering device

1989-09-08

1991-03-19

Weisstuch, Aaron

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

20419212, 20419215, 2041922, 20429817, C23C 1435

Patent

active

050008340

ABSTRACT:
A Facing Targets Sputtering device for making a thin film comprises: a pair of targets with magnets placed at opposite positions within a container so as to face each other so as to maintain a space for a plasma region; and first and second power sources respectively connected to the both targets and being controllable independently from each other, so that electric energies supplied to the targets can be independently controlled. Therefore, the composition of the thin film can be readily selected and controlled even during operation.

REFERENCES:
patent: 4828668 (1989-05-01), Yamazaki et al.
patent: 4963524 (1990-10-01), Yamazaki

Affiliated with

Also associated with

Rating

Facing targets sputtering device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Facing targets sputtering device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Facing targets sputtering device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2008106