Fabrication techniques for multilayer ceramic modules

Details Fabrication techniques for multilayer ceramic modules Fabrication techniques for multilayer ceramic modules

1975-11-26

1977-05-24

Duzan, James R.

Metal working

Method of mechanical manufacture

Electrical device making

29420, 174 685, 427 97, B41M 308

Patent

active

040246299

ABSTRACT:
Metallized through-holes are provided in insulating substrates by placing the substrate onto an absorbant carrier and screening a metallization paste, which contains a metal component dispersed in an organic solvent, into the holes. The carrier absorbs the solvent and a portion of the paste adheres to the carrier. When the carrier is stripped from the substrate it carries with it the center portion of the paste to leave a thin layer of paste on the inner surface of the substrate.

REFERENCES:
patent: 3518756 (1970-07-01), Bennett et al.
patent: 3770529 (1973-11-01), Anderson
patent: 3838204 (1974-09-01), Ahn et al.
patent: 3948706 (1976-04-01), Schmeckenbecher
B509,772, Mar. 1976, Chirino et al., 174/68.5.
IBM Technical Disclosure Bulletin, vol. 16, No. 5, Oct. 1973, p. 1497.
IBM Technical Disclosure Bulletin, vol. 16, No. 1, June 1973, pp. 243, 242.
IBM Technical Disclosure Bulletin, vol. 11, No. 9, Feb. 1969, p. 1111.

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