Fabrication system, light-emitting device and fabricating...

Coating processes – Direct application of electrical – magnetic – wave – or... – Pretreatment of coating supply or source outside of primary...

Reexamination Certificate

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Details

C427S248100, C427S249100, C118S719000, C118S726000

Reexamination Certificate

active

10651286

ABSTRACT:
The present invention provides a vapor deposition system for a film forming systems that promote an efficiency of utilizing an EL material and is excellent in uniformity or throughput of forming an EL layer and a vapor deposition method. According to the present invention, vapor deposition is carried out in a deposition chamber by moving an evaporation source holder903on which six containers911filled with an evaporation material are set at a certain pitch with respect to the substrate. The evaporation holder903is transported from an installation chamber905by a transport mechanism902b. A heater is provided in a turntable907. Throughput can be improved by heating the evaporation holder903in advance of transporting containers into the evaporation holder903.

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PCT/JP-03/11099 Written Opinion dated Jun. 15, 2004.

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