Fabrication processes for monolithic electronic modules

Details Fabrication processes for monolithic electronic modules Fabrication processes for monolithic electronic modules

1994-06-02

1996-05-21

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

257777, 269903, 437 51, 437208, 437209, 437974, H05K 334

Patent

active

055177549

ABSTRACT:
This invention comprises various high production methods for simultaneously forming surface metallizations on a plurality of monolithic electronic modules. Each monolithic electronic module may comprise a single semiconductor chip or multiple semiconductor chips. The methods can employ a workpiece which automatically discontinues side surface metallization between different electronic modules in the stack. Multiple workpieces are interleaved within the stack between the electronic modules. Each workpiece may include a transfer layer(s) for permanent bonding to an end surface of an adjacent electronic module in the stack. This transfer layer may comprise an insulation layer, a metallization layer, an active circuit layer, or any combination thereof. End surface metallization can thus be provided contemporaneous with side surface metallization of multiple electronic modules.

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