Metal working – Method of mechanical manufacture – Electrical device making
Patent
1994-06-30
1996-04-09
Vo, Peter
Metal working
Method of mechanical manufacture
Electrical device making
29852, 427 97, 427 98, 216108, H05K 302, H05K 342
Patent
active
055049923
ABSTRACT:
The object of the present invention is to provide a wiring board fabrication process which is, not only so smooth on the surface that a fine wiring pattern can be formed thereon, but also suitable for mounting electronic parts having fine pitch terminals.
The present invention is a fabrication process of a wiring board which comprises a wiring conductive line embedded in the surface of an insulating substrate so that the upper face of the conductive line and the surface of the substrate are flat, and a through-hole land which is a conductive portion projected from the surface of the substrate in a through-hole portion, which is characterized in removing the conductive portion projected from the surface of the substrate in the through-hole portion so as to have a flat surface on the surface of the substrate.
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Patent Abstracts of Japan, unexamined application, E field, vol. 15, No. 390.
Romankiw et al "Plating Through-Holes" IBM Tech. Discl. Bul., vol. 9, No. 10, Mar. 1967 pp. 1255-1256.
Fukutomi Naoki
Itabashi Masahiko
Ohhata Hirohito
Tsubomatsu Yoshiaki
Yamazaki Toshio
Hitachi Chemical Company Ltd.
Vo Peter
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