Fabrication process of wiring board

Details Fabrication process of wiring board Fabrication process of wiring board

1995-03-27

1997-09-09

Vo, Peter

Metal working

Method of mechanical manufacture

Electrical device making

29DIG16, 29847, 216 52, H05K 306

Patent

active

056643250

ABSTRACT:
A wiring board is fabricated through the following steps:
(A) forming, on one side of an elongated carrier metal foil made of a first metal, a thin layer with a second metal whose etching conditions are different from those of the first metal;
(B) forming, on a surface of the thin layer, a desired wiring pattern with a third metal whose etching conditions are different from those of the second metal;
(C) superposing the carrier metal foil on an insulating substrate with the side of the wiring pattern being positioned inside, whereby the wiring pattern is embedded in the insulating substrate; and
(D) etching off the carrier metal foil and the thin layer at desired parts thereof.

REFERENCES:
patent: 3324014 (1967-06-01), Modjeska
patent: 4306925 (1981-12-01), Lebow et al.
patent: 4790902 (1988-12-01), Wada et al.
patent: 5017271 (1991-05-01), Whenell et al.

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