Fabrication process of semiconductor device and polishing...

Abrading – Precision device or process - or with condition responsive... – Computer controlled

Reexamination Certificate

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C451S010000, C451S011000, C451S056000, C451S072000, C451S443000

Reexamination Certificate

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07597606

ABSTRACT:
A method of fabricating a semiconductor device includes a polishing process of a substrate, wherein the polishing process includes the steps of applying a chemical mechanical polishing process to the substrate on a polishing pad while using slurry, and conditions a surface of the polishing pad, the conditioning step including the step of grinding the surface of said polishing pad by at least first and second conditioning disks of respective, different surface states.

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