Fabrication process of a semiconductor device including a dicing

Details Fabrication process of a semiconductor device including a dicing Fabrication process of a semiconductor device including a dicing

1997-10-17

1999-12-28

Picardat, Kevin M.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

438460, H01L 2144

Patent

active

060080698

ABSTRACT:
A rotary dicing blade includes a rotary hub, a blade edge provided on the rotary hub along an outer periphery thereof, and abrasive particles provided on the blade edge, wherein the abrasive particles contain fullerene particles.

REFERENCES:
patent: 5288342 (1994-02-01), Job

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