Fabrication process of a semiconductor device including a dicing

Details Fabrication process of a semiconductor device including a dicing Fabrication process of a semiconductor device including a dicing

1997-09-11

1999-11-09

Brown, Peter Toby

Semiconductor device manufacturing: process

Semiconductor substrate dicing

With attachment to temporary support or carrier

438460, 438113, 438458, 438977, H01L 21301

Patent

active

059813610

ABSTRACT:
A method of fabricating a semiconductor device includes the steps of, after sawing a semiconductor substrate into individual semiconductor chips in a state that the semiconductor substrate is covered by an adhesive tape, applying a dry gas to the adhesive tape in a state that the adhesive tape carries thereon the semiconductor chips, applying an infrared radiation to the adhesive tape in a state that the adhesive tape carries thereon the semiconductor chips, and curing the adhesive layer on the adhesive tape in a state that the adhesive tape carries thereon the semiconductor chips, by irradiating a ultraviolet radiation to the adhesive tape, wherein the step of applying the dry gas, the step of applying the infrared radiation and the said step of curing the adhesive layer are conducted substantially simultaneously.

REFERENCES:
patent: 5238876 (1993-08-01), Takeuchi et al.
patent: 5534102 (1996-07-01), Kadono et al.
patent: 5578133 (1996-11-01), Sugino et al.
patent: 5622900 (1997-04-01), Smith
patent: 5641714 (1997-06-01), Yamanaka
patent: 5733814 (1998-03-01), Flesher et al.
patent: 5759874 (1998-06-01), Okawa

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