Fabrication process for package with light emitting device...

Details Fabrication process for package with light emitting device... Fabrication process for package with light emitting device...

2007-02-15

2010-06-08

Thai, Luan C (Department: 2891)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Including integrally formed optical element

C438S026000, C438S025000, C438S048000, C438S106000

Reexamination Certificate

active

07732234

ABSTRACT:
A method of fabricating a package with a light emitting device includes depositing a first metallization to form a conductive pad on which the light emitting device is to be mounted and to form one or more feed-through interconnections extending through a semiconductor material that supports the conductive pad. Subsequently, a second metallization is deposited to form a reflective surface for reflecting light, emitted by the light emitting device, through a lid of the package. Deposition of the second metallization is de-coupled from deposition of the first metallization.

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