Fabrication process for circuit substrate having interconnection

Details Fabrication process for circuit substrate having interconnection Fabrication process for circuit substrate having interconnection

1995-10-19

1997-09-30

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29418, 29827, 29832, H05K 334

Patent

active

056715315

ABSTRACT:
A method for manufacturing an apparatus includes the steps of forming a plurality of circuit regions on a single master print circuit board, soldering one or more interconnection leads upon corresponding pad electrodes of the foregoing circuit regions, in a state that the plurality of circuit regions are connected with each other mechanically to form the master print circuit board, and dividing the master print circuit board into individual printed circuit boards each corresponding to one of the circuit regions on the master print circuit board.

REFERENCES:
patent: 4316320 (1982-02-01), Nogawa et al.
patent: 4343083 (1982-08-01), Takemura et al.
patent: 4343084 (1982-08-01), Wilmarth
patent: 4426773 (1984-01-01), Hargis
patent: 4641112 (1987-02-01), Kohayakawa
patent: 4980219 (1990-12-01), Hiraide et al.
patent: 5031073 (1991-07-01), Chang

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