Fabrication process for circuit boards

Details Fabrication process for circuit boards Fabrication process for circuit boards

1995-06-06

1997-10-28

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

427 97, H01K 310

Patent

active

056807015

ABSTRACT:
A process with several variants is presented which permits the layer thickness of the conductive layers on a circuit board to be independent of the layer thickness of the conductive layers in the holes. To this end, the surface structure of the circuit board, in particular the conductors, are initially completed, covered with a solder stop mask, and it is only then that the holes bared by exposure and development of the solder stop mask and, if required, lands and pads, are metallized.

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Patent Abstracts of Japan vol. 14, No. 22 Jan. 17, 1990 "Manufacture of Printed Wiring Board".

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