Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2005-06-03
2008-10-28
Smith, Zandra (Department: 2822)
Metal working
Method of mechanical manufacture
Electrical device making
C029S830000, C029S831000, C029S832000, C029S833000, C029S846000, C438S107000, C438S108000, C438S109000, C438S382000, C438S401000, C361S748000, C361S760000, C361S761000, C361S762000, C361S763000, C361S764000, C361S765000, C361S766000
Reexamination Certificate
active
07441329
ABSTRACT:
A process for fabricating a circuit board with embedded passive component is provided. A conductive layer including a first surface and a second surface opposing to the first surface is provided. The conductive layer has first through holes passing through the conductive layer, respectively. At least one passive component material layer is formed on the first surface. A circuit unit including second through holes is provided. Locations of the second through holes are corresponding to the locations of the first through holes, respectively. The conductive layer and the circuit unit are aligned by the first through holes and the second through holes, while the first surface of the conductive layer faces the circuit unit, and the passive component material layer is between the circuit unit and the conductive layer. The conductive layer is laminated to the circuit unit. The conductive layer is patterning to form a circuit layer.
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Au Bac H
Jianq Chyun IP Office
Smith Zandra
Subtron Technology Co. Ltd.
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