Metal working – Method of mechanical manufacture – Electrical device making
Patent
1995-10-12
1998-03-03
Vo, Peter
Metal working
Method of mechanical manufacture
Electrical device making
29846, 29874, 216 18, 430313, H05K 310
Patent
active
057221626
ABSTRACT:
An interconnecting post for mounting a microelectronic device such as an integral circuit chip is fabricated with generally uniform cross-section, by forming a first layer of positive photoresist on a substrate, soft-baking that first layer and exposing it for a short time with a wide-apertured mask or simply a UV blank flood exposure. Without developing the first layer, a second layer of positive resist is then applied over the first layer, soft-baked, and then exposed with a narrow-apertured mask. During the soft-baking of the second layer, some of its activator in the photoresist compound diffuses into the exposed portion of the first layer and modifies its solubility in such a way that, when the layers are subsequently developed, the developer partially undercuts the unexposed portion of the first layer to form in the photoresist an opening of generally uniform cross-section. This opening can then be filled by plating to produce a strong, integral interconnect post.
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Beilin Solomon I.
Chou William T.
Horine David A.
Kudzuma David
Lee Michael G.
Fujitsu Limited
Nguyen Khan V.
Vo Peter
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