Fabrication of ultra-shallow channels for microfluidic...

Details Fabrication of ultra-shallow channels for microfluidic... Fabrication of ultra-shallow channels for microfluidic...

2007-02-06

2007-02-06

Chambers, A. Michael (Department: 3753)

Fluid handling

Processes

Cleaning, repairing, or assembling

C137S833000, C438S693000, C438S704000

Reexamination Certificate

active

10366087

ABSTRACT:
A method for etching an ultra-shallow channel includes using an etch process that is selective for one material to etch a different material in order to achieve a very precise channel depth in the different material. Channels as shallow as 10 nm can be fabricated in silicon with precision of 5 nm or better using the method. Stepped channels can be fabricated where each segment is a different depth, with the segments being between 10 nm and 1000 nm in depth. The method is applied to create a fluidic channel which includes a channel substrate to which is bonded a lid substrate to confine fluids to the fluidic channels so fabricated.

REFERENCES:
patent: 5618760 (1997-04-01), Soh et al.
patent: 6729352 (2004-05-01), O'Connor et al.
patent: 6790698 (2004-09-01), Miller et al.
patent: 6880576 (2004-09-01), Miller et al.
patent: 6899137 (2005-05-01), Unger et al.

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