Fabrication of thermal microphotonic sensors and sensor arrays

Details Fabrication of thermal microphotonic sensors and sensor arrays Fabrication of thermal microphotonic sensors and sensor arrays

2009-06-25

2010-10-26

Porta, David P (Department: 2884)

Radiant energy

Invisible radiant energy responsive electric signalling

Infrared responsive

Reexamination Certificate

active

07820970

ABSTRACT:
A thermal microphotonic sensor is fabricated on a silicon substrate by etching an opening and a trench into the substrate, and then filling in the opening and trench with silicon oxide which can be deposited or formed by thermally oxidizing a portion of the silicon substrate surrounding the opening and trench. The silicon oxide forms a support post for an optical resonator which is subsequently formed from a layer of silicon nitride, and also forms a base for an optical waveguide formed from the silicon nitride layer. Part of the silicon substrate can be selectively etched away to elevate the waveguide and resonator. The thermal microphotonic sensor, which is useful to detect infrared radiation via a change in the evanescent coupling of light between the waveguide and resonator, can be formed as a single device or as an array.

REFERENCES:
patent: 6489615 (2002-12-01), Bluzer
patent: 6777244 (2004-08-01), Pepper et al.
patent: 6888973 (2005-05-01), Kolodziejski et al.
patent: 2003/0052271 (2003-03-01), Fedder et al.
patent: 2006/0091284 (2006-05-01), Viens et al.
patent: 2007/0110358 (2007-05-01), Hu et al.
John R. Vig et al, “Microresonator Sensor Arrays”, 1995 IEEE International Frequency Control Symposium, May 31-Jun. 2, 1995, San Francisco, CA, pp. 852-869.
John R. Vig et al, “Uncoiled IR Imaging Array Based on Quartz Microresonators”, Journal of Microelectromechanical Systems, vol. 5, No. 2, 1996, pp. 131-137.
Yoonkee Kim et al, “Experimental Results on a Quartz Microresonator IR Sensor”, 1997 IEEE Ultrasonics Symposium, Oct. 5-8, 1997, Ontario, Canada, 1997, pp. 449-453.
Tomohiro Ishikawa et al, “Performance of 320×240 Uncolled IRFPA with SOI Diode Detectors”, Proceedings of SPIE, vol. 4130 (2000), pp. 152-159.
P. Neuzil et al, “Evaluation of thermal parameters of bolometer devices”, Applied Physics Letters, vol. 80, No. 10, 2002, pp. 1838-1840.
Pavel Neuzil et al, “Micromachined Bolometer With Single-Crystal Silicon Diode as Temperature Sensor”, IEEE Electron Device Letters., vol. 26, No. 5, 2005, pp. 320-322.
D. K. Armani et al, “Ultra-high-Q toroid microcavity on a chip”, Letters to Nature, vol. 421, Feb. 27, 2003, pp. 925-928.
Michael J. Shaw et al, “Fabrication techniques for low loss silicon nitride waveguides”, Proceedings of SPIE Bellingham,WA, vol. 5720, 2005, pp. 109-118.
Junpeng Guo et al, “High-Q microring resonator for biochemical sensors”, Proceedings of SPIE Bellingham,WA, vol. 5728, 2005, pp. 83-92.
Michael R. Watts et al, “Thermal Microphotonic Focal Plane Array (TM-FPA) for Uncooled High Sensitivity thermal Imaging”, Paper presented at IEEE Conference on Lasers and Electro-Optics (CLEO 2007), Baltimore, MD, May 6-11, 2007.
Michael R. Watts et al, “Optical Resonators—Microphotonic Thermal Imaging”, Nature Publishing Group, 2007.

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