Fabrication of thermal ink-jet feed slots in a silicon substrate

Details Fabrication of thermal ink-jet feed slots in a silicon substrate Fabrication of thermal ink-jet feed slots in a silicon substrate

1995-09-22

1997-08-19

Powell, William

Etching a substrate: processes

Forming or treating thermal ink jet article

216 2, 216 41, 216 56, B44C 122, H01L 2100

Patent

active

056584717

ABSTRACT:
Improved methods for fabricating the ink feed slots in silicon substrate for use in thermal ink-jet print heads is disclosed. One method involves the partial anisotropic etching of an ink feed slot in a silicon substrate for use in aligning the electrical resistive elements on one surface of the substrate. Another embodiment involves laser drilling alignment holes and anisotropically etching the substrate. In both methods, at least one photoresist masking and development step is eliminated thereby reducing fabrication time and alignment difficulties for locating the feed slots relative to the electrical resistance elements and increasing product yield.

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