Fabrication of substrates for multi-chip modules

Details Fabrication of substrates for multi-chip modules Fabrication of substrates for multi-chip modules

1993-12-20

1995-07-25

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174250, 174258, H05K 100

Patent

active

054364116

ABSTRACT:
Poor sidewall coverage of vias in substrates for multi-chip modules is alleviated by forming pillars associated with conductors on an underlying metal wiring layer. In one embodiment, the pillars are disposed underneath the conductors, causing portions of the conductors to be pushed up through an overlying insulating layer towards a metal layer overlying the insulating layer. The pillars can be electrically conductive or insulating, and can be thermally conductive. In another embodiment, the pillars are disposed atop the conductors, thereby extending at least partially through the insulating layer. These pillars are electrically conductive.

REFERENCES:
patent: 4159401 (1979-06-01), Kamata
patent: 4708770 (1987-11-01), Pasch
patent: 4963512 (1990-10-01), Iwanaga et al.
patent: 5174646 (1992-12-01), Siminovitch et al.
patent: 5248854 (1993-09-01), Kudoh et al.
patent: 5266746 (1993-11-01), Nishihara et al.

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