Fabrication of stacked microelectronic devices

Details Fabrication of stacked microelectronic devices Fabrication of stacked microelectronic devices

2007-11-20

2007-11-20

Osele, Mark A. (Department: 1734)

Stock material or miscellaneous articles

All metal or with adjacent metals

Composite; i.e., plural, adjacent, spatially distinct metal...

C428S041100, C428S041700, C438S976000, C156S249000, C156S299000

Reexamination Certificate

active

11386208

ABSTRACT:
Manufacture of stacked microelectronic devices is facilitated by producing subassemblies wherein adhesive pads are applied to the back surfaces of a plurality of microelectronic components in a batch fashion. In one embodiment, an adhesive payer is applied on a rear surface of a wafer. A plurality of spaced-apart adhesive pads are defined within the adhesive layer. Each adhesive pad may cover less than the entire back surface area of the component to which it is attached. A mounting member (e.g., dicing tape) may be attached to the adhesive layer and, in some embodiments, the adhesive layer may be treated so that the mounting member is less adherent to the adhesive pads than to other parts of the adhesive layer, easing removal of the adhesive pads with the microelectronic components.

REFERENCES:
patent: 7022418 (2006-04-01), Connell et al.
patent: 7037751 (2006-05-01), Connell et al.
AI Technology, UV Releasing Tape, “Dicing & Lapping Tapes for Wafer and Substrate,” 3 pages, Nov. 12, 2001, <http://www.aitechnology.com/dicingtape/prod03—uv—release—dice.htm>.
Lintec-USA, UV Curable Adhesive, 3 pages, Nov. 12, 2001 <http://www.lintec-usa.com/Contents/Products/Tape/Uvad.htm>.

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