Fabrication of semiconductor modules with ceramic substrates and

Details Fabrication of semiconductor modules with ceramic substrates and Fabrication of semiconductor modules with ceramic substrates and

1981-10-19

1983-09-27

Parrish, John A.

Plastic and nonmetallic article shaping or treating: processes

Shaping or treating luminescent material

264 22, 264 61, 264 63, 264 67, C09K 110

Patent

active

044068441

ABSTRACT:
To detect residual glass, such as appears at semiconductor chip pads and via holes during the fabrication of alumina/glass ceramic substrates that are used as supports for the semiconductor devices, the glass used for forming the ceramic substrates is doped with a rare earth oxide. During the manufacturing process, the ceramic structures are irradiated after firing with radiation of wavelengths in the range 350-500 nanometers to induce the glass to fluoresce, thereby revealing the residual glass on the surface of the metallic interconnector pads. If residual glass is present, the parts are reworked, or scrapped if necessa

REFERENCES:
patent: 2635329 (1953-04-01), de Forest et al.
patent: 2945128 (1960-07-01), Sun
patent: 3117227 (1964-01-01), Pollack
patent: 3386920 (1968-06-01), Alburger
patent: 3718601 (1973-02-01), Dentai
patent: 3995157 (1976-11-01), Holub et al.
patent: 4313900 (1982-02-01), Gonzales

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