Fabrication of printed circuit boards using conducting polymer

Details Fabrication of printed circuit boards using conducting polymer Fabrication of printed circuit boards using conducting polymer

1989-08-14

1994-04-05

Niebling, John

Electrolysis: processes, compositions used therein, and methods

Product produced by electrolysis involving electrolytic...

205125, 205164, C25D 502, C23C 2800

Patent

active

053002083

ABSTRACT:
A process for fabricating a printed circuit board concerns the use of a soluble, air-stable conducting polymer applied to plated through holes, blind holes or vias or to a predetermined portion of the printed circuit board surface for selectively metal plating on the polymer without the necessity of either an electroless plating bath or the use of precious metal seeds. A preferred conducting polymer is polyaniline. A preferred metal plating is preferably copper or a noble metal such as palladium or silver.

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patent: 4783243 (1988-11-01), Ando

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