Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Including integrally formed optical element
Reexamination Certificate
2005-03-08
2005-03-08
Pham, Long (Department: 2814)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Including integrally formed optical element
C438S022000, C438S584000
Reexamination Certificate
active
06864114
ABSTRACT:
A fabrication method reduces minimum waveguide spacing in an integrated optical device. Core regions of the waveguides are etched into cladding material and then filled with core material, instead of etching the spacing between the core material first and then filling the spacing. This allows the spacing between the core regions to be made arbitrarily small, without being constrained by an aspect ratio associated with a conventional etch and deposition/re-flow process used to form waveguide spacings.
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patent: 02251912 (1990-10-01), None
patent: 09080246 (1997-03-01), None
Nikonov Dmitri E.
Wang Everett X.
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