Semiconductor device manufacturing: process – Making passive device
Reexamination Certificate
2005-05-10
2005-05-10
Coleman, W. David (Department: 2823)
Semiconductor device manufacturing: process
Making passive device
C257S531000
Reexamination Certificate
active
06890829
ABSTRACT:
The invention relates to a process of forming an on-chip package inductor. The process includes providing a substrate with at least one microelectronic device packaged therewith. As part of the inventive process, electrical communication is formed for the microelectronic device. The electrical communication includes at least two electrically conductive layers. As part of the inventive technology, the inductor is patterned on the substrate before, during, or after formation of the electrical communication. The inductor is connected to the at least one microelectronic device.
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Cheng Peng
Ma Qing
Coleman W. David
Intel Corporation
Schwegman Lundberg Woessner & Kluth P.A.
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