Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal
Reexamination Certificate
2006-05-30
2006-05-30
Mulpuri, Savitri (Department: 2812)
Semiconductor device manufacturing: process
Making device or circuit responsive to nonelectrical signal
C438S050000, C438S052000, C438S053000
Reexamination Certificate
active
07052926
ABSTRACT:
A method of fabricating a high-aspect ratio micro-mechanical device or system with dimensions that can vary from nanometers to millimeters is disclosed. According to the method, a tool master with a high-aspect ratio, submicron lateral resolution and vertical dimensions substantially corresponding to the vertical dimensions of the device or system is formed. The tool master and a substrate sized for the device or system are heated to a temperature at which the substrate becomes compliant. The heated tool master and substrate are then pressed together so as to imprint the shape and form of the tool master into the substrate. The temperature of the tool master and substrate are then lowered, whereupon the tool master and substrate are separated and cooled to ambient temperature. The tool master can have a plurality of duplications to form a plurality of devices or systems. The substrate is composed of a laminate comprised of a sacrificial layer and a structural layer. The sacrificial layer can be removed to release the structural layer and thereby form a movable device or system.
REFERENCES:
patent: 5496668 (1996-03-01), Guckel et al.
patent: 5858622 (1999-01-01), Gearhart
patent: 6461888 (2002-10-01), Sridhar et al.
patent: 6477225 (2002-11-01), Morales et al.
patent: 6482553 (2002-11-01), Gottert et al.
patent: 2002/0117599 (2002-08-01), Domeier et al.
patent: 2003/0062652 (2003-04-01), Lee et al.
patent: 2003/0080472 (2003-05-01), Chou
patent: 2003/0091752 (2003-05-01), Nealey et al.
patent: 2003/0219992 (2003-11-01), Schaper
patent: 2004/0087162 (2004-05-01), Vogeli
patent: 2004/0089903 (2004-05-01), Fischer et al.
patent: 2004/0146139 (2004-07-01), Morales
patent: 2004/0206881 (2004-10-01), Tavkhelidze et al.
patent: 2004/0239006 (2004-12-01), Hong
patent: 2005/0056074 (2005-03-01), Meng
Qu et al, UV-LIGA: A Promising and Low-Cost Variant for Microsystem technology, 1999 IEEE pp 380383.
McNie et al, Advanced Micromechanical Prototyping In Polysilcion AnD SOI Pp 8/1 to 8/4.
Wang et al, “Fabrication of Monolithic Multilevel High-aspect-Ratio Ferromagnetic Devices” Journal of Micrelctromecahnical Systems, vol. 14, No. 2, Aril 2005 pp 400-409.
Sugiyam et al, a compact SR beamline for Fabrication of High aspect Ratio MEMS Microparts1996 IEEE pp 79-84.
Corporation for National Research Initiatives
Mulpuri Savitri
Nixon & Vanderhye P.C.
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