Fabrication of microfluidic circuits by printing techniques

Details Fabrication of microfluidic circuits by printing techniques Fabrication of microfluidic circuits by printing techniques

1997-12-10

2000-06-13

Loney, Donald

Stock material or miscellaneous articles

Structurally defined web or sheet

Longitudinal or transverse tubular cavity or cell

428198, 428204, 428206, 428210, 156277, 156290, 156292, 427 211, 73 2339, 73 6153, 204603, 436180, B32B 322, B32B 3100, G01N 3000

Patent

active

060747250

ABSTRACT:
Laminates having microfluidic structures disposed between sheets of the laminate are provided. The microfluidic structures are raised on a sheet of laminate, typically by printing the structure on the sheet. Printing methods include Serigraph, ink-jet, intaligo, offset printing and thermal laser printing.

REFERENCES:
patent: 5075152 (1991-12-01), Tsukuda et al.
patent: 5171132 (1992-12-01), Miyazaki et al.
patent: 5271724 (1993-12-01), van Lintel
patent: 5277556 (1994-01-01), van Lintel
patent: 5375079 (1994-12-01), Trah
patent: 5376252 (1994-12-01), Ekstrom et al.
patent: 5736188 (1998-04-01), Alcock et al.
patent: 5750240 (1998-05-01), Findley et al.
patent: 5824204 (1998-10-01), Jerman
McLaughlin et al., "Development of a Thick-Film Thermal Print Head", International Microelectronic Symposium, pp. 1A-4-1-1A-4-14 (1973).
Hann et al., "Dye Diffusion Thermal Transfer (D2T2) Color Printing", The Fifth International Congress on Advances in Non-Impact Printing Technologies, pp. 441-448 (1979).

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