Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2003-11-24
2008-08-26
Valenza, Joseph (Department: 3651)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C029S025420, C438S123000
Reexamination Certificate
active
07416630
ABSTRACT:
A method of fabricating a transmit/receive (T/R) module utilizing low temperature co-fired ceramic (LTCC) material in place of high temperature co-fired ceramic (HTCC) material and utilizing a combination of multiple lamination steps which also include forming a ceramic frame, as opposed to a metal ring frame, in the process. Brazing metallization is also utilized to attach heat sinks and lids as well as pin connectors. The formation of the pin connectors is provided on the side surface of the T/R module with a side printing process.
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Curbean Andrea
Fisher, III John S.
Gupta Tapan K.
Jacobson Rena Y.
Andrews & Kurth LLP
Northrop Grumman Corporation
Valenza Joseph
LandOfFree
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